| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer grinding pad and a semiconductor wafer grinding double-layer body capable of optical end-point detection without a degradation in grinding performance, and to provide a semiconductor wafer grinding method. <P>SOLUTION: The grinding pad has a grinding pad substrate 11 having a through hole penetrating through the top surface and the rear surface and a translucent member 12 inserted into the through hole. The translucent member comprises a water-insoluble matrix (1,2-polybutadiene) and water-soluble particles (β-cyclodextrin) dispersed into the water-insoluble matrix. In the sum of the water-insoluble matrix and the water-soluble particles accounting for 100% in volume, the water-soluble particles occupy less than 5% in volume. The grinding-double layer body is constructed by attaching a supporting layer on the rear surface of the grinding pad. A fixing layer 13 may be attached to the rear sides of the grinding pad and the grinding double-layer body. <P>COPYRIGHT: (C)2004,JPO |
