发明名称 IMPROVEMENTS TO CERAMIC PACKAGES FOR HIGH FREQUENCY CIRCUITS
摘要 Projecting elongate stub walls are provided on the planar surfaces of a substrate at positions where bonding of the substrate to a clamping lid or base is to be carried out. On firing of the substrate, the surfaces thereof are mechanically processed but since the stub walls protrude from the substrate, the grinding and polishing tools make contact with the surfaces of these stub walls, rather than with the entire substrate surface. As a result, the area of the substrate to be processed is minimised and problems with dishing and erosion are alleviated. This allows the clamping lid, or frame to be bonded, using conventional conductive adhesive processes, avoiding the cracking and stress problems associated with non-uniformity of the surface of the ceramic substrates.
申请公布号 EP1842232(A1) 申请公布日期 2007.10.10
申请号 EP20060700795 申请日期 2006.01.23
申请人 EADS ASTRIUM LIMITED 发明人 RUMER, SIMON, LEONARD
分类号 H01L21/50;H01L21/48;H01L23/10;H01L23/13;H01L23/15 主分类号 H01L21/50
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