发明名称 |
VAPOR CHAMBER WITH BOILING-ENHANCED MULTI-WICK STRUCTURE |
摘要 |
<p>A heat transfer device includes a chamber with a condensable fluid with an evaporative region coupled to a heat source. Within the chamber is a boiling-enhanced multi-wick structure.</p> |
申请公布号 |
EP1842021(A1) |
申请公布日期 |
2007.10.10 |
申请号 |
EP20050818804 |
申请日期 |
2005.11.30 |
申请人 |
CONVERGENCE TECHNOLOGIES LIMITED |
发明人 |
SIU, WING MING |
分类号 |
F28D15/02;G06F1/20;H01L23/427;H05K7/20 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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