发明名称 APPARATUS FOR TRANSFERRING SUBSTRATE
摘要 An apparatus for transferring a substrate is provided to prevent a scratch by removing connection elements on an upper surface of a module contacting with the substrate. An apparatus for transferring a substrate comprises an upper body(30) with multiple air injection holes in one side to an associated transferring substrate, a lower body(40) which is connected to the upper body and forms a predetermined air flowing space between the lower body and the upper body, and a module(20) having a fan for generating air to the air injection hole. The connection area between the upper body and the lower body is installed in a lower area of the air injection hole.
申请公布号 KR20070100008(A) 申请公布日期 2007.10.10
申请号 KR20060031516 申请日期 2006.04.06
申请人 SFA ENGINEERING CORP. 发明人 JUNG, JUN MO;KIM, YONG O;HEO, MOO YONG;JANG, YOUNG CHUL
分类号 G02F1/13 主分类号 G02F1/13
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