| 摘要 |
An ion implantation apparatus is provided to reduce maintenance hours and to prevent the surface of a wafer from contaminated by installing and removing a detachable contaminant adhesion pad to the internal wall of the ion implantation apparatus. An ion implantation apparatus includes a number of guide bars and detachable contaminant adhesion pads(317a,317b). The detachable contaminant adhesion pads(317a,317b) can be installed at each side, top or bottom of inside of a chamber. The detachable contaminant adhesion pads(317a,317b) can be made as planar rectangles for effectively preventing the surface of the inside of the chamber from being exposed and contaminated by contaminants.
|
