| 摘要 |
A PCB(Printed Circuit Board), a package the PCB, and a manufacturing method thereof are provided to improve the reliability of the PCB and the package by preventing defects caused by the difference of a moisture absorbing characteristic and a thermal characteristic between materials. A PCB includes a carrier, a circuit pattern(28), a connecting pad(32) and a ball pad(34). The carrier is made of conductive material, and the circuit pattern(28) is formed on the carrier. The connecting pad(32) is formed on the carrier, is electrically connected to the circuit pattern(28), and is used for the electric connection with a chip. The ball pad(34) is formed on the carrier with a plating layer(22) for the connection with an external connecting unit, is electrically connected with the circuit pattern(28), and is used for the electric connection with outside. |
