发明名称 |
Apparatus and method for multiprocessor circuit board |
摘要 |
One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.
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申请公布号 |
US7280364(B2) |
申请公布日期 |
2007.10.09 |
申请号 |
US20040996722 |
申请日期 |
2004.11.24 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
HARRIS SHAUN L.;BELSON STEVEN A.;PETERSON ERIC C.;WILLIAMS GARY W.;BELADY CHRISTIAN L.;CHRISTENSON JEFFREY P. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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