发明名称 Method of forming metal fine particle pattern and method of forming electroconductive pattern
摘要 A method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by a cross-linking reaction, forming a graft polymer region in a pattern on the surface of the polymerization initiation layer, wherein the graft polymer layer has the ability to contain a metal ion or a metal salt, adding a metal ion or a metal salt to the graft polymer layer, and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal fine particle dispersion region; and a method of forming an electroconductive pattern using the method of forming a metal fine particle pattern.
申请公布号 US7279195(B2) 申请公布日期 2007.10.09
申请号 US20040921355 申请日期 2004.08.19
申请人 FUJIFILM CORPORATION 发明人 KANO TAKEYOSHI;KAWAMURA KOICHI
分类号 B05D3/00;G03F7/004;B41M3/00;B41M5/36;G03F7/038;G03F7/04;G03F7/09;G03F7/095;G03F7/11;G03F7/23;G03F7/26;G03F7/38;G03F7/40;H05K3/10;H05K3/18 主分类号 B05D3/00
代理机构 代理人
主权项
地址