| 发明名称 |
Partitioned integrated circuit package with central clock driver |
| 摘要 |
Disclosed are IC partitioned packaging and interconnection constructions that provide for improved distribution of power, ground, cross chip interconnections and clocks. |
| 申请公布号 |
US7279783(B1) |
申请公布日期 |
2007.10.09 |
| 申请号 |
US20040977355 |
申请日期 |
2004.10.29 |
| 申请人 |
SILICON PIPE, INC. |
发明人 |
FJELSTAD JOSEPH C.;GRUNDY KEVIN P.;SEGARAM PARA K.;OBENHUBER, LEGAL REPRESENTATIVE INESSA |
| 分类号 |
H01L23/02;H01L23/34;H01L23/48;H01L23/52 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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