发明名称 |
Method and apparatus for inspecting an edge exposure area of a wafer |
摘要 |
For an automatic defect inspection of an edge exposure area of a wafer, an optical unit supplies a light beam onto the edge portion of a wafer and a detection unit detects light reflected from the edge portion. The detection unit converts the detected light into an electrical signal to transmit the electrical signal to a processing unit. The processing unit analyzes the electrical signal to measure the reflectivity of the edge portion, compares the measured reflectivity with a reference reflectivity, and calculates the width of the edge exposure area. The processing unit compares the calculated width with a reference width to detect any defect in the edge exposure area.
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申请公布号 |
US7280233(B2) |
申请公布日期 |
2007.10.09 |
申请号 |
US20040787765 |
申请日期 |
2004.02.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN KOUNG-SU;CHOI SUN-YONG;JUN CHUNG-SAM;LEE DONG-CHUN;YOON KWANG-JUN |
分类号 |
G01B11/02;H01L21/66;G01B11/14;G01B11/28;G01N21/00;G01N21/95 |
主分类号 |
G01B11/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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