| 摘要 |
An apparatus and a method for removing a thin film are provided to improve a removal rate of the thin film by removing the thin film from a base substrate regardless of the kind of thin films by grinding thin film layers by using friction between a grinding tape and the thin film layers. An apparatus for removing a thin film(100) includes a roller unit(121,123,125,127) which generates driving power by rotating in a direction, a grinding tape(110) which has a closed loop, rotates in a direction by the driving power by being rolled in the roller unit, and removes a thin film layer(220) from a base substrate(210) through the friction with the thin film formed on the base substrate, and an air spray unit(130) which is positioned in the closed loop defined by the grinding tape and controls an interval between the grinding tape and the base substrate by spraying air to the grinding tape.
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