发明名称 |
Apparatus for controlling thermal interface between cold plate and integrated circuit chip |
摘要 |
The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also includes a finger member having a rounded tip centered on the top surface. The heat sink device also includes a force generating device having an anvil spaced from the finger member and a compressible member compressed between the anvil and the finger member. The compressible member generates a pressing force urging the finger member and the top surface together. The heat sink device also includes a moving device operable to move one of the anvil and the finger member relative to the other to change the pressing force generated by the compressible member.
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申请公布号 |
US7280363(B2) |
申请公布日期 |
2007.10.09 |
申请号 |
US20050040623 |
申请日期 |
2005.01.21 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
REYZIN ILYA;BHATTI MOHINDER SINGH;SCHERER LAWRENCE P.;HAYES ANDREW R.;JOSHI SHRIKANT MUKUND |
分类号 |
H05K7/20;F28F7/00;H01B9/06;H02G3/03 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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