Stair step printed circuit board structures for high speed signal transmissions
摘要
Disclosed are stair stepped PCB structures which provide high performance, direct path, via-less interconnections between various elements of an electronic interconnection structure including, among others, IC packages and connectors.
申请公布号
US7280372(B2)
申请公布日期
2007.10.09
申请号
US20040990280
申请日期
2004.11.15
申请人
SILICON PIPE
发明人
GRUNDY KEVIN P.;WIEDEMANN WILLIAM F.;FJELSTAD JOSEPH C.