| 发明名称 |
Integrated inductors and compliant interconnects for semiconductor packaging |
| 摘要 |
Some embodiments of the present invention include integrated inductors and compliant interconnects for semiconductor packaging.
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| 申请公布号 |
US7279391(B2) |
申请公布日期 |
2007.10.09 |
| 申请号 |
US20050251403 |
申请日期 |
2005.10.14 |
| 申请人 |
INTEL CORPORATION |
发明人 |
HSU ROCKWELL;MUTHUKUMAR SRIRAM;HE JIANGQI |
| 分类号 |
H01L21/20;H01L21/44;H01L23/485 |
主分类号 |
H01L21/20 |
| 代理机构 |
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