发明名称 Semiconductor laser device and manufacturing method thereof
摘要 It is an object of the present invention to provide a semiconductor laser device with high-yielding in which a clack generated in an epitaxial growth layer is restrained and to the manufacturing method thereof, the semiconductor laser device includes a GaN substrate 1 , an n-type GaN layer 2 , an n-type AlGaN cladding layer 3 , a n-type GaN guide layer 4 , an InGaN multiple quantum well active layer 5 , an undoped-GaN guide layer 6 , a p-type AlGaN electron overflow suppression layer 7 , a p-type GaN guide layer 8 , a SiO<SUB>2 </SUB>blocking layer 9 , an Ni/ITO cladding layer electrode 10 as a transparent electrode, a Ti/Au pad electrode 11 , and a Ti/Al/Ni/Au electrode 12 . The SiO<SUB>2 </SUB>blocking layer 9 is formed above the InGaN multiple quantum well active layer 5 so as to have an opening. The Ni/ITO cladding layer electrode 10 is formed inside the opening, and which is transparent for the light from the InGaN multiple quantum well active layer, and serves as a cladding layer.
申请公布号 US7279751(B2) 申请公布日期 2007.10.09
申请号 US20050109787 申请日期 2005.04.20
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 UEDA TETSUZO;YURI MASAAKI
分类号 H01L27/01;H01L29/06;H01S5/042;H01S5/20;H01S5/223;H01S5/343 主分类号 H01L27/01
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