| 摘要 |
A substrate processing apparatus and a method are provided to restrain process failure from being generated at one portion of a wafer supported by a support unit and to rotate simultaneously a plate and the support unit using one driving source. A substrate processing apparatus includes a rotatable plate(10), a processing solution supply unit(20) for supplying a processing solution onto a substrate loaded on the plate, support units, a change unit, a driving unit and a control unit. The support units(30) are installed on the plate in order to prevent the deviation of the wafer from the plate due to the rotation of the plate. The support unit is composed of a support portion(32) for supporting a side of the substrate and a body portion(34) for fixing the support portion. The change unit(40) is used for changing the position of the support portion. The driving unit(50) is used for rotating the support portions. The control unit(60) is used for controlling the driving unit while the processing solution is supplied onto the substrate. The change unit is composed of a first driving gear(42) and first following gears. The first following gears(46) are arranged around the first driving gear.
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