| 摘要 |
A light emitting diode structure and its manufacturing method are provided to improve a light emissive angle by installing light emitting diodes opposite to each other at different portions of a lead frame. A light emitting diode includes a lead frame(100), a light emitting chip, a wire, and a package molding part. The light emitting chip(200) is arranged at the lead frame. The wire(300) is used for connecting electrically the light emitting chip and the lead frame with each other. The package molding part(400) is used for enclosing the lead frame, the light emitting chip and the wire. The lead frame are composed of a first lead frame with a first curve portion, a third lead frame spaced apart from one side of the first lead frame, a second lead frame with a second curved portion, and a fourth lead frame spaced apart from one side of the second lead frame. The first curved portion encloses the third lead frame. The second curved portion encloses the fourth lead frame. The light emitting chip is arranged one surface and the other surface of the lead frame, respectively.
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