| 摘要 |
An internal power monitoring device is provided to reduce the number of bonding pads for internal power monitoring, by using a bonding pad for data mode selection as an internal power monitoring pad. A pad(110) for data mode selection receives an internal voltage and an external data mode selection signal selectively. A transfer part(140) outputs the internal voltage to the pad for data mode selection in response to an internal power test signal. A latch unit(160) latches the data mode selection signal and outputs the latched data mode selection signal to an internal circuit of a semiconductor memory device.
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