IMAGE SENSOR MODULE AND FABRICATION METHOD THEREOF

摘要

An image sensor module and its manufacturing method thereof are provided to be stably mounted on a PCB without wire bonding and solder balls by using reflow soldering. An image sensor includes an image sensing chip(110), a lower substrate, an upper substrate, and a connection terminal. The lower substrate(120) has a predetermined space capable of holding the image sensing chip. The upper substrate(130) is arranged on the lower substrate. The upper substrate has a window portion corresponding to an image sensing region of the image sensing chip. The connection terminal(140) is electrically connected with the image sensing chip. A circuit pattern is electrically connected to the connection terminal to expose the connection terminal to the outside between the upper and the lower substrates.