| 摘要 |
A method for manufacturing a semiconductor device is provided to prevent the deterioration of an anti-cycle characteristic and an anti-reflow characteristic by preventing an adhesive layer from being attached to a rear surface of a die attaching film. A method for manufacturing a semiconductor device includes the steps of: forming a fragmented layer inside a semiconductor wafer(1W) by radiating laser to the semiconductor wafer(1W); loading the semiconductor wafer(1W) on a dicing tape via a adhesion layer; curing the adhesion layer of the dicing tape(5); bending and dividing the semiconductor wafer from the fragmented layer; and widening a chip interval by extending the dicing tape(5) from an outer circumference of the dicing tape(5).
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