| 摘要 |
A connecting device for electronic components is provided to be applied to both welding connection and soldering connection and to connect electronic components such as unpackaged components and a packaged or unpackaged integrated circuit. A connecting device(1) for electronic components(3a,3b,4,5) connects the electronic components(3a,3b,4,5) to the electric conductivity of at least one substrate(2). The connecting device(1) is formed in a shape of a film composite body composed of at least one insulating film(14) and two electric conductivity films(10,12). The film composite body is arranged in a shape of a layer where the insulating film(14) and the electric conductivity films(10,12) are formed alternatively and forms a conductor track by being composed of at least one conductivity film(10,12). At least one conductivity film(10,12) of a main area of the film composite body has a first metal. At least one film part has a layer composed of a second metal thinner than the thickness of the conductive films(10,12). |
