| 摘要 |
<p>A mold for resin molding, a resin molding apparatus, and a method of manufacturing a semiconductor device are provided to prevent an electric short due to metallic foreign substances mixed in resin. A mold for resin molding includes a pot(11), a cavity(19), a runner(12), and a foreign substance staying unit(13). The pot(11) receives resin. An object for resin molding is received in the cavity(19). The runner(12) guides the resin received in the pot(11) to the cavity(19). The foreign substance staying unit(13) is installed near the pot(11) of the runner(12). The foreign substance staying unit(13) has a magnet(22).</p> |
