| 摘要 |
The arrangement has contact surfaces (2), which are not holohedrally soldered, where the contact surfaces are firmly soldered with a section of a conductive strip (5) in a surface region (7) and are not firmly connected with a printed circuit board in a surface region (10). The surface region (7) lying at a semiconductor or sensor structure to be contacted is thicker than the surface region (10), which is not connected with the printed circuit board.
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