| 摘要 |
A conductive paste composition comprising a bump-forming aid is provided to form a coating film with a sufficient thickness by a single coating step and to form a bump with a desired height by a smaller number of coating steps. A conductive paste composition comprises a bump-forming aid containing a phenolic resin, a melamine resin, conductive powder, a solvent and a monohydric alcohol having a terminal methoxy group and at least one ether bond. The bump-forming aid preferably has an ethylenedioxy moiety in its molecular structure. Particularly, the bum-forming aid is at least one compound selected from the group consisting of 2-methoxyethanol, diethyleneglycol monomethylether and triethyleneglycol monomethylether.
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