| 摘要 |
A ceramic multi-layer PCB(Printed Circuit Board) and a manufacturing method thereof are provided to reduce a size of an element, which is mounted on the PCB by laminating plural layers with different dielectric constants. A ceramic multi-layer PCB includes first and second multi-layer boards(201,202) and a third multi-layer board(203). Ceramic boards with high dielectric constants are laminated on the first and second multi-layer boards respectively. Ceramic boards with low dielectric constants are laminated between the first and second multi-layer boards to form the third multi-layer board. A line pattern is embedded on one of the layers. Circuit patterns of a passive element are formed at left/right portions of the multi-layer board. A line pattern for electrically coupling the left/right portions with each other is formed on the third multi-layer board.
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