| 摘要 |
<p>PURPOSE: A substrate for TBGA(Tape Ball Grid Array) semiconductor package and a method for fabricating the same are provided to improve adhesive strength between a solder material and a solder ball by forming a conductive pad at an edge of a via hole. CONSTITUTION: A metallic thin film for forming a circuit is adhered on a non-conductive polymer resin film(21a). An etching resister is coated on the metallic thin film. An exposure process, a development process, and a stripping process for the etching resister are performed. A circuit pattern layer(21b) is formed by removing the remaining etching resister. A photo solder resist(21c) is coated on the remaining part except for a pattern part of the circuit pattern layer. An adhesive is coated on an opposite part of the non-conductive polymer resin film(21a) to the circuit pattern layer(21b). A cavity(23a) and a via hole(27) are formed thereon.</p> |
