SUBSTRATE HOLDING APPARATUS, POLISHING APPARATUS, AND POLISHING METHOD

摘要

A substrate holding apparatus, a polishing apparatus, and a polishing method are provided to perform stably a polishing process on a substrate by preventing the substrate from being slid. A substrate holding apparatus includes a top-ring(1) and a polishing table(100). A polishing pad(101) is attached to an upper surface of the polishing table. A polishing liquid supply nozzle(102) is arranged on the polishing table. The polishing liquid supply nozzle supplies a polishing liquid to the polishing pad. The top-ring is connected to a lower end of a top-ring shaft(11), which is vertically moved with respect to a top-ring head(110) by a vertical transfer unit(24). A rotary joint(25) is mounted on the top-ring shaft. When the vertical transfer unit moves the top-ring shaft in a vertical direction, the top-ring is raised or lowered as a whole and determines a position of the top-ring head.