发明名称 Slim type LED package
摘要 A slim LED package is provided to prevent brightness from being deteriorated when the light from an LED is scattered to a sidewall by emitting the greater part of the light of the LED upward. A substrate(100) includes a bottom plate(110) and a pair of sidewalls formed at both ends of the bottom plate. At lest one LED(200) is formed on the bottom plate, constructed to emit light upward. A light transmitting material(600) is filled in the substrate to stain the LED. The LED can be a thin-fill gallium nitride LED in which a reflection layer, a P-type gallium nitride layer, a multilayered quantum well and an N-type gallium nitride are sequentially and upwardly stacked.
申请公布号 KR100764420(B1) 申请公布日期 2007.10.05
申请号 KR20050128497 申请日期 2005.12.23
申请人 发明人
分类号 H01L33/00;H01L33/52;H01L33/58 主分类号 H01L33/00
代理机构 代理人
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