A magazine for manufacturing a semiconductor package is provided to receive a strip regardless of the size of the strip by forming a moving member at a lateral surface of a fixing member. A fixing member(10) includes a vertical member(10a) having an inner surface and a horizontal member(10b) formed from upper and lower ends of the vertical member to a horizontal direction. A plurality of slots are formed in an inner surface of the vertical member. A first guide panel(15) is formed in parallel to the horizontal member at the upper and lower ends of the inside of the vertical member. A second guide panel(16) is inserted between the horizontal member and the first guide panel. A moving member(11) is formed in the vertical direction to a second guide panel. A plurality of slots are formed in the inside of the moving member. A fixing unit fixes the second guide panel to the fixing member in order to control a constant width by using the moving member.
