PLANARIZATION APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER

摘要

An apparatus and a method for planarizing a semiconductor substrate are provided to reduce a damage of the substrate when transferring a process substrate by using a cleaning solution without an abrasive grain. An apparatus(10) for planarizing a semiconductor substrate includes a substrate receiving stage(13), a multi-joint transfer robot(14), a substrate holder table(70a), and a polishing process stage(70). The substrate receiving stage(13) is formed at the right side of the outside of a room from the front side of the apparatus(10) toward the back side. The multi-joint transfer robot(14) has an absorption arm(14a) near the substrate receiving stage(13) on the front row inside the room. The substrate holder table(70a) is formed at the left side of the multi-joint transfer robot(14) to constitute a substrate loading/unloading/finish polishing stage(ps1). The polishing process stage(70) arranges a substrate holder table(70b) constituting a rough polishing stage(ps2) on the concentric circle of a second index-type rotary table(71).