| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of giving a high performance cured film excellent in exposure tolerance, development tolerance, PCT resistance, via shape, heat resistance, developability, adhesion, thermal shock resistance, electric corrosion resistance, flexibility and mechanical properties, and suitable for use in the production of a printed wiring board, a high density multilayer plate, a semiconductor package and the like. <P>SOLUTION: The photosensitive resin composition comprises (A) an acid modified vinyl group-containing epoxy resin which is an addition reaction product obtained by adding (c) a saturated or unsaturated polybasic acid anhydride to a product by esterification of (a) an epoxy compound having two or more epoxy groups in one molecule and (b) an unsaturated monocarboxylic acid, (B) a photopolymerization initiator, (C) a diluent, (D) a curing agent and (E) an acrylic resin having a weight average molecular weight of 30,000-120,000. <P>COPYRIGHT: (C)2008,JPO&INPIT |
