COMPONENT INCORPORATED PRINTED WIRING BOARD, MANUFACTURING METHOD FOR COMPONENT INCORPORATED PRINTED WIRING BOARD, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To manufacture a component incorporated printed wiring board which has high reliability by a manufacturing technique which is economically advantageous without interposing a processing stage for resin injection etc., for void removal.

SOLUTION: Electrodes 12 and 12 to which an electronic component 20 to be incorporated by solder bonding are provided with void guide grooves 13 and 13 to form a void guide path (aa), and consequently a void (V) formed in the gap between the reverse surface of the electronic component 20 and a component mount surface part can securely be removed.

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