发明名称 DIE BOND DICING FILM
摘要 PROBLEM TO BE SOLVED: To obtain a die bond dicing film that does not cause a change in adhesive force with time after integration of a die bond film with a dicing tape. SOLUTION: The die bond dicing film is one obtained by laminating and integrating the mutual adhesive layers of a dicing tape 2 comprising a side-chain crystalline polymer as an adhesive layer with a die bond film 1 that has an adhesive layer which is non-adhesive at a normal temperature, has shear viscosity of 10-100,000 Pa s in a temperature range of 40-80°C. The adhesive layer of the dicing tape is a side-chain crystalline polymer layer having a modulus of elasticity of 1×10<SP>6</SP>-1×10<SP>9</SP>MPa and a weight-average molecular weight of 300,000-1,000,000. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007254590(A) 申请公布日期 2007.10.04
申请号 JP20060080729 申请日期 2006.03.23
申请人 NIPPON STEEL CHEM CO LTD;NITTA IND CORP 发明人 HAYATA KAZUNOBU;TAKASO DAISUKE;KAWAHARA SHINICHIRO
分类号 C09J7/02;C09J201/00;H01L21/301;H01L21/52 主分类号 C09J7/02
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