BONDED STRUCTURE, BONDING METHOD, AND ADHESIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a bonded structure excellent in heat resistance and adhesive properties. SOLUTION: A pair of materials to be bonded is bonded by an organic/inorganic hybrid layer obtained by a condensation reaction between a metal and/or a metal alkoxide and a polyorganosiloxane having functional groups which can be reacted with the alkoxide at one terminal or both terminals. The organic/inorganic hybrid layer has heat resistance and indicates excellent adhesive properties to an organic material and an organic material. COPYRIGHT: (C)2008,JPO&INPIT