发明名称 Thin film device
摘要 A thin film device is provided, in which inductance can be increased when a thin film coil wound on a magnetic film is provided. In a thin film coil wound on a magnetic film, thickness of lower coil portions is smaller than thickness of upper coil portions. Consequently, a magnetic property (permeability) tends to be hardly deteriorated.
申请公布号 US2007230042(A1) 申请公布日期 2007.10.04
申请号 US20070727502 申请日期 2007.03.27
申请人 TDK CORPORATION 发明人 FUJIWARA TOSHIYASU
分类号 G11B5/17;G11B5/147 主分类号 G11B5/17
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