MANUFACTURING METHOD OF IMBEDDED PCB

摘要

A manufacturing method of an electric device embedded PCB(Printed Circuit Board) is provided to reduce process cost by embedding the electric device and minimizing the number of effective processes. A manufacturing method of an electric device embedded PCB includes the steps of: mounting an electric device to be electrically connected with a pattern on a first copper film(S11); laminating an insulating layer with a cavity at a position corresponding to the electric device on a second copper film with a conductive protrusion(S12); embedding the electric device in the cavity, and laminating the first copper film and the second copper film to be electrically connected to the conductive protrusion(S13); and forming a circuit pattern by removing a part of the first copper film and the second copper film(S14).