发明名称 METHOD FOR AMENDING BONDING COORDINATES UTILIZING REFERENCE BOND PADS
摘要 <p>A method for amending bonding coordinates using reference bond pads is provided to amend the bonding coordinates on the basis of a searched result of reference bond pads when it is failed to search the position of die recognition regions. A method for amending bonding coordinates includes a process for amending the bonding coordinates according to a position of a loaded die and positions of loaded leads. In the method, a first amending process is performed to search die recognition regions and positions of lead recognition regions, to compare the positions of the searched recognition regions with predetermined positions, and to amend the bonding coordinates of the die and the leads according to the compared result. A second amending process is performed to search reference bond pads(P5-P9), to compare the positions of the searched reference bond pads with predetermined positions, and to amend the bonding coordinates of the die and the leads according to the compared result when the positions of the die recognition regions are not searched in the first amending process.</p>
申请公布号 KR20070097158(A) 申请公布日期 2007.10.04
申请号 KR20060027974 申请日期 2006.03.28
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 CHUNG, YONG BOK;CHO, JEONG HO
分类号 H01L21/60 主分类号 H01L21/60
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