| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition that gives ample heat resistance and mechanical characteristics even by a heat treatment at a temperature as low as 280°C or lower, and to provide a method for manufacturing a pattern, and an electronic component. <P>SOLUTION: A negative photosensitive resin composition is applied by spin coating on a semiconductor substrate 1 having a first conductor layer 3, a second conductor layer 7 and an interlayer insulating film 4 formed thereon, that is dried, irradiated with light through a mask having a pattern to form a window 6C in a predetermined portion, developed with an alkali aqueous solution, and heated (cured) to form a surface protective film layer 8. The negative photosensitive resin composition comprises (a) a polymer, soluble with an alkali aqueous solution, (b) a compound which generates an acid by irradiation with active rays, and (c) a compound which crosslinks or polymerizes with at least an end group of the component (a) by the effect of an acid. <P>COPYRIGHT: (C)2008,JPO&INPIT |
