| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an RFID tag for reducing a material cost and a processing cost, and furthermore, reducing a cost of a whole of RFID manufacturing as much as possible by employing a process for continuously mounting semiconductor elements onto a manufactured circuit. <P>SOLUTION: A manufacturing method of the RFID tag including at least a base material, a circuit and a semiconductor element includes (a) a process of forming an opening by patterning a resist on a metal substrate; (b) a process of depositing a circuit-shaped pattern at the opening on the substrate by means of plating; (c) a process of transferring the pattern from the substrate to the base material to form the circuit; (d) a process of making a recess at a part of the circuit on the base material; (e) a process of joining a junction electrode of a semiconductor element with a protruded junction electrode disposed thereon to the section with the recess disposed therein in the circuit on the base material; and (f) a process of fixing, with a resin, the section, in which the semiconductor element is mounted, out of the base material. <P>COPYRIGHT: (C)2008,JPO&INPIT |
