发明名称 PART MOUNTING SYSTEM, PART MOUNTING DEVICE SETTING METHOD, INFORMATION PROCESSOR, AND PROGRAM
摘要 <P>PROBLEM TO BE SOLVED: To improve production throughput in a mounting process of a part to a substrate, in a system comprising a plurality of part mounting devices. <P>SOLUTION: The system comprises a part mounting setting process device 12 and a plurality of part mounting devices 1. The part mounting device 1 uses the data from the part mounting setting device 12 to control a part supply 3, a part supply 4, and a substrate positioning part 5, with a calculation processor 2 for mounting a part on the substrate being comprised. The part mounting setting process device 12 uses both the distribution information of a part on the substrate which is stored in advance, and the data about a part supply member for housing parts and attaching reference time required for attaching parts to calculate an approximate value of the part mounting time on the substrate performed by the part mounting device 1 for each part attaching device. It allocates a part supply member and a part to be mounted for each part mounting device 1 so that the calculated approximate value is consistent, and transmits the allocated data to the part mounting device 1. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007258560(A) 申请公布日期 2007.10.04
申请号 JP20060083065 申请日期 2006.03.24
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 CHIDA TAKAFUMI;ATTILA LENGYEL;IGARASHI TAKESHI;YAMAGUCHI HARUHIKO;OKAMOTO MANABU;IZUMIHARA KOICHI
分类号 H05K13/04 主分类号 H05K13/04
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