| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame whose adhesion with a sealing resin is elevated and its reliability is more improved, its lead frame manufacturing method, and a semiconductor device with the lead frame. <P>SOLUTION: In a resin-sealing type semiconductor device 1, a semiconductor chip 3 is mounted at the predetermined position of the lead frame 5 and is sealed by a sealing resin 7 in its state. The semiconductor chip 3 is die-bonded to the lead frame 5 interposing a preform 9 on the lead frame 5. A recess/protrusion portion 6 is formed on the surface of the lead frame 5, and a hook portion 5c is formed at a tip portion of a protrusion 5b positioned between the recess 5a and recess 5a. The hook portion 5c is formed by crashing the tip portion of the protrusion 5b and is extended laterally so as to hook the sealing resin 7 entering into the recess portion 5a. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
