| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board capable of improving via connection reliability and via thermal reliability. <P>SOLUTION: In this manufacturing method of a wiring board 10, a through hole forming step of forming a hole 18 for a through hole and a drilling step of forming a first main surface side via hole 56 are firstly executed. Then, plating bathing for through hole plating is executed, and a first plating step is executed for performing plating for the hole 18 for through hole to form a through hole conductor 16 and performing plating for the first main surface side via hole 56. After the first plating step, a second plating step of forming a first filled via conductor 51 is executed by performing plating using plating bathing for filled via. After the second plating step, a hole filling printing step for filling a cavity 19 of the through hole conductor 16 with a hole filling material 17 is executed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
