摘要 |
PROBLEM TO BE SOLVED: To enable sure formation of an identification code which is difficult in an identification code because of a physical shape such as an opening shape formed by a usual method, in a tape carrier semiconductor manufactured by a method such as a subtractive method. SOLUTION: The manufacturing method of a tape carrier and the manufacturing method of a tape carrier semiconductor comprise a process for providing an identification code for each manufacturing unit of a long tape, a process for providing a protection tape covering the identification code on the identification code surface, a plating process, and a process for forming a tape carrier by a protection tape peeling process. COPYRIGHT: (C)2008,JPO&INPIT
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