发明名称 PARTICLE DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of efficiently depositing particles inside openings of a resist by scattering the particles on a substrate coated with the resist having the openings. SOLUTION: In the method of depositing particles inside the openings of the resist by scattering the particles on the substrate coated with the resist having the openings, the particles are scattered after applying flux inside the openings. The flux has a kinematic viscosity adjusted to 1-20 mm<SP>2</SP>/s. For scattering the particles, the particles can be blasted using a gas pressure. Preferably, vibration is applied to the substrate during the scattering of the particles. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007258408(A) 申请公布日期 2007.10.04
申请号 JP20060080204 申请日期 2006.03.23
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 ITABASHI KAZUMITSU
分类号 H01L21/60 主分类号 H01L21/60
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