| 摘要 |
PROBLEM TO BE SOLVED: To prevent a ceiling in a cap and an internal element from making contact with each other owing to stress by mold resin in a mold package yielded by sealing with a mold resin an oscillator formed by covering an internal piezoelectric element with a cap having a gap therebetween. SOLUTION: The mold package is obtained by sealing the oscillator 10 with the mold resin 40. The oscillator 10 is yielded by covering a piezoelectric element 11 with a box-shaped cap 13, and has a hollow part between an internal surface of the plate-shaped ceiling 13a facing the piezoelectric element 11 in the cap 13 and the piezoelectric element 11. In the mold package, the ceiling 13a has a protruded plate shape protruded in a direction leaving from the piezoelectric element 11. COPYRIGHT: (C)2008,JPO&INPIT
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