| 摘要 |
To prevent breakage of a membrane probe during a probe test using a probe card having the membrane probe, appearance of a main surface of a wafer as a test object is tested by an appearance tester 51 , and results of bad appearance such as adhesion of a foreign substance to the main surface of the wafer and abnormality in shape of bump electrodes over the main surface of the wafer are collected as wafer map data according to arrangement of respective chips in a plane of the wafer, then the wafer map data are transmitted to a probe tester 53 via a server 52 , and the probe tester 53 omits the probe test for chips in which bad appearance was detected, and concurrently performs the probe test to other chips in which bad appearance was not detected, based on the wafer map data.
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