Elektronisches Bauteil und Halbleitervorrichtung

摘要

An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint (8) in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board (6) and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board (6) and an electrode of the electronic part are connected by soldering using a lead free solder (8) consisted of Cu: 0 SIMILAR 2.0 mass%, In: 0.1 SIMILAR 10 mass%, and Sn: remaining amount.