| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive composition which can be calcined at low temperature not only under an inert atmosphere but the air atmosphere, in which oxidation of copper particles can be prevented, which shows superior conductivity, and which is inexpensive, and provide a forming method of a conductive film using that conductive composition in the inert atmosphere or the air atmosphere. <P>SOLUTION: This is the conductive composition having copper as a filler, and contains metal powders consisting of mixture of copper powders of which the average particle diameter is 0.3-20μm and fine copper powders of which the average particle diameter is 1-50 nm, a solvent composed of multivalent alcohol having two or more of OH groups such as ethylene glycol or diethylene glycol, and an additive composed of a compound which has two or more of COOH groups and one or more of OH group and of which the number of the COOH groups is the same number or more of the OH groups such as malic acid or citric acid. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
