| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface processing method for improving heat transmission efficiency with a substrate by making a surface of an electrostatic chuck to be smooth. SOLUTION: A substrate processor is provided with a chamber storing a wafer. A susceptor as a mounting stand on which the wafer is mounted is arranged in the chamber. The electrostatic chuck 42 is arranged on the susceptor. In the electrostatic chuck 42, a sprayed coating 1 is formed on the surface. A grinding stone 2 made into a disk shape by hardening abrasive grains is brought into contact with the coating so as to cut the surface. A lap plate 3 is sprayed on the surface with suspension as a mixture of the abrasive grains and lubricant, and brought into contact with the surface. Thus, the surface is cut to be flat. A tape 5 of the tape lap device 4 having the tape 5 to which the abrasive grains 9 are applied and fixed, and a roller 6 formed of an elastic body is brought into contact with the tape lap device 4 by adding pressure to the tape lap device 4 so as to cut the surface to be smooth. COPYRIGHT: (C)2008,JPO&INPIT |
