| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-sink device which improves the heat dissipation performance and reduces the external noise and the radiation noise. SOLUTION: The heat-sink device having a heat sink attached to a multilayer printed board has inner layer patterns. The heat-sink device includes a mounting pattern which is formed on the multilayer printed board, is connected electrically to a given inner layer pattern, and is formed into a through-hole shape, a metallic mounting stud whose one end is inserted and fixed in the mounting pattern, and a mounting means for removably mounting the heat sink on the other end of the mounting stud. COPYRIGHT: (C)2008,JPO&INPIT
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